[工学]Reflow defect analysis_4

[工学]Reflow defect analysis_4smt process trainingreflow soldering defects analysis回流焊缺陷分析 回流焊缺陷分析learning objectives/学习目的 学习目的 1. know the common defect 了解常见缺陷类型 ฀ 2.analysize the possible cause 分析可能的原因 ฀ 3untermeasure for the defects 基于以上原因采取的对策2tombstoning/ 立碑• chip components standing on a terminal end (tombstoning&..